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    Compound Semiconductor

    Advanced Dicing Technologies

    Dicing Saws/ Blades & laser Scribing Systems + Peripherals.

    Takatori Corporation

    Vacuum, Lamination, Separation, Control & Information Processing, Transfer & Drive, Cutting, Cleanliness, Taping & De-taping Equipment for Grinding & Dicing Processes.

    Royce Instruments

    High precision testing machines for wire bond pull, ball bond shear, die shear, ball pull and stud pull. Pick and place machines for silicon.

    Thinky

    World Leader in the development and manufacturers of MIXERS.

    North Star Imaging

    NSI provides World Class Industrial Digital X-ray and 3D Computed Tomography Systems.

    KLA-Tencor

    High-Precision Mechanical Contact Profilers and Optical Profiler.

    VLSI Standards

    Leading supplier of NIST traceable calibration standards and calibration certificates.

    Thin Film Stress Measurement Tool: NEW MODEL The industry standard in thin film stress analysis.

    Provides a complete line of die-singulation products for dry-icing, saw dicing, wafer bonding and wafer expanding processes.

    Insight K.K.

    IKK offers systems, services and training in the field of non-destructive testing technology (NDT). In particular, Insight specialised in non-destructive testing by using Ultrasound technology.

    Trebor International

    High Purity Air Operated Diaphragm Pump and DI Water/ Chemical heater.

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