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    Royce Instruments

    Royce Instruments bond testers handle a wide variety of chip and wire testing applications such as Wire bond pull test, Ball bond shear test, Solder ball shear test, Solder ball pull test, Die bond shear test, Zone shear test.
    Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection. Ideal for MEMS and other devices with fragile geometry.
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